Communication
Contacts
Offering
Investors
Careers
Libraries of Standard cells and Memories
Logic virtual components
Analog virtual components
Test structures
 Hardware/Software Codesign
Virtual test & diagnostic
 Hardware/Software Codesign
Layout verification
My MEDAL
Quadrant of skills
SoC Integration
Custom Fabless Supplier
 
 

Search dolphin:

DOLPHIN Integration unique actor for Application Engineering of Silicon IP

 

Grenoble, France, August 20, 2010

The complexity of Systems-on-Chip tends to obscure their crucial connections to physical peripherals around it. The leader of Silicon IP for High Resolution converters is facing the difficulties of system peripherals for Audio and Measurement, with a new breed of Application Engineers. They address the all-too-often ignored expenses of performance losses due to connections and their Bill-of-Material increases.

The Silicon IP provider is accompanying their customers to ensure a safe and fast integration of high resolution ViCs in their SoC, with innovative support from Field Application Engineers and with new types of deliverables: models, templates…  Specific care must be taken when embedding high resolution Analog Front-Ends in a SoC. Indeed, even if the CODEC of an audio application has a SNR of 95 dB, the final performance, once embedded in a SoC and together with its application schematics, can be degraded up to 20 dB due to disturbances on both the power and clock networks. One of the solutions sometimes envisioned is to overestimate the performance of each component in order to guarantee the performance of the final system. Wrong expectation: a spoiled power supply will anyhow degrade the overall SNR whatever the SNR of the codec!

For several years now, Dolphin’s Application Engineers have acquired a deep understanding of critical issues on so called hot spots of designs and mastered the modeling of application schematics to secure them by simulation. A combination of novel Integration Hardware Models (IHM within SoCs) and Application Hardware Models (AHM within PCBs) can rely on the unique multi-level, Logic and mixed signal, simulator SMASH.

Custom Training Packages (CTP) now ensure sufficient transfer of know-how on modeling. SoC design teams are now offered the keys to reduce Time-to-Market and yield by releasing right-on-first-pass products. Furthermore, application engineers of Fabless Suppliers of SoCs can properly support their own customers.

For more information on the training program and the course description, please click here or contact directly the product manager Nathalie Dufayard at solutions@dolphin-integration.com

 

 

MEDAL News

Would you like to be informed when new SMASH releases are available?
MEDAL News is a low traffic moderated mailing list that notifies subscribers of updates and new releases. Mailing list subcription (joining) and unsubscription (leaving) is automatically handled by email messages. Upon subscription, you will automatically receive a confirmation email to which you must simply reply in order to confirm subscription.

E-mail: