Jazz, The enabler of audio Systems-On-Chip
The best performance-silicon area ratio for Audio and Voice applications
Low-power, low voltage for high resolution measurement ADC
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News Corner
Jan. 25, 2010 - The embedded audio CODEC with smallest power consumption on the market!
Nov. 27, 2009 - Ingenic and Dolphin Integration announce their renewed cooperation in the field of audio converters
Oct. 19, 2009 - Light on CD10ACN50, a high-performance 100 dB Audio CODEC in Fujitsu Microelectronics' 90 nm
Oct. 2, 2009 - Dolphin Integration paves the way to the "Super-ViC" generation for audio applications
July 27, 2009 - Launch of moDAC95-LB combining smallest silicon area and optimized Bill-of-Material
June 29, 2009 - Dolphin Integration's Audio converter Helium lightens both Power consumption and Bill-of-Material
May 15, 2009 - New patented solutions for pop-up noise reduction
April 17, 2009 - SMIC and Dolphin Integration announce strategic partnership for Portable Media Players | 
February 2nd, 2009 - Launch of our new range of embedded codecs
September 29, 2008 - A new offering of high-resolution audio DACs for resident consumer applications
March 31, 2008 - More configurations for the audio CODEC proven with 100 dB
Feb. 01, 2008 - Class-D vs Class-AB for headphone amplifiers
Jul. 16, 2007 - High-resolution, low-noise ADC for sensor applications
Feb. 22, 2007 - A new generation of Audio CODECs with embedded voltage regulator
Dec. 18, 2006 - shCODlp-100.01 - Give 100 dB to your mixed-signal SoC
Jun. 16, 2006 - Our CODEC is embedded in Rockchip RK2606
May, 2006 - IP Japan 2006 conference
Dec. 22, 2005 - voCODlv-80.01: a key CODEC in your portfolio
What resilience to expect from an analog ViC to disturbances from the logic rest of SoC?
Availability of low-power and high-density audio CODEC in TSMC 0.18 µm |
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The purpose of integrating an audio Component into a SoC improves its competitiveness compared to a mere PCB solution. However this choice is a challenge for SoC integrators. Providers of Audio Virtual Components must demonstrate:
System-level performances comparable to ICs with the best trade-off with silicon area.
Strong market differentiators thanks to flexible configurations of the embedded functions.
Right-on-First pass integration to ensure Time-To-Market.
Since 1985, DOLPHIN Integration has provided the right mixed-signal virtual components for audio and voice applications at the right time, enabling this success story built on yield and audio quality.
Overview of Analog Front-Ends
For your complete and competitive System-on-Chip, you
need our analog products which eliminate any requirement for competency
in analog design: consult their promotion sheets, datasheets, and their
associated simulation models and test benches to simplify your evaluation
and design in.
Voice - Voice CODECs |
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Audio - Audio ADCs | Audio DACs | Audio CODECs | Sound Effects | Digital Audio Interface |
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Measurement - ADCs |
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Embedded Power Management - LDO | DC-DC converters |
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Proven in action since 1985 with 200 Virtual Components ultimately made real on Silicon, in more than 20 different process nodes thanks to:
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Our “Virtual Fab” Process: Design and simulation performed with a set of calibrated models guaranteeing a higher robustness.
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A set of innovations and patented solutions.
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A track record of Right-on-First pass silicon in different process nodes and foundries.
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An audio quality perceived by Golden Ears to be as good as the best external codec IC’s.
Improve your RoI thanks to the best performance / silicon area trade-off!
Avoid over-sizing the audio converters to get reasonable sound quality after integration, as SNR and THD are guaranteed on silicon:
Improve your RoI thanks to the lowest Bill-of-Material
The lowest silicon area is achieved at no compromise on PCB contents:
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Speaker and headphone drivers are proposed with discrete-free connections
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Single-ended application schematics of analog inputs and outputs can be provided to reduce the number of pins
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Direct battery connection is enabled thanks to embedded power-supply voltage regulators
Ensure the best SoC value with a customized ADC/DAC/CODEC thanks to Jaxaudio
Virtual Components are configured per the 3 F’s: Functions, Features and Fabrication process. To ensure the perfect 3 F’s for a targeted application, the proven solution is to develop the ViC from a kit: a configured assembly of ADC and / or DAC core(s) and peripheral(s) both analog and digital.
Ensure your Time-to Fab
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The kit approach avoids designing from scratch.
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Ensure a smooth integration flow since deliverables can be used as black boxes:
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Digital Model for SoC simulation
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Reference layout for routing to Pads
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Sockets for LVS and DRC
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Integration rules
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Application schematics and PCB guidelines
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Check compliance with Integration Rules before tape-out through GDSII review.
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Ensure a proper usage of the deliverables through a set of acceptance testbench and their associated review with the design team.
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Address in real time all other specific questions related to integration through our ViC Engineering Support.
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