High-Resolution Analog Converters and Sub-systems: Audio CODEC, AFE Measure
Full range of ADC and DAC configurations,
Optimized architectures,
High Density,
Low Power
|
|
|
|
The purpose of integrating an audio Component into a SoC is usually to improve competitiveness compared to stand alone audio IC solution.
However this choice is often a challenge for electronic system makers and SoC integrators. Audio Virtual Components providers and SoC integrators must demonstrate:
- System-level performances comparable to standalone audio ICs with the best trade-off with silicon area.
- Strong market differentiators thanks to flexible configurations of the embedded functions.
- Right-on-First pass integration to ensure Time-To-Market.
Since 1985, DOLPHIN provides mixed-signal virtual components for audio and voice applications, a true success story built on audio quality and high yield during fabrication.
2 Major markets for voice and audio applications
- Nomad devices requiring Low Power (PMP, MP3, DSC, mobile phone, etc.)
- Residential devices requiring High SNR (Set Top Box, PC cards, Digital TV, car audio etc.)
see the complete market of our High-Resolution Converters
Proven in action since 1985…
…with 200 Virtual Components on Silicon, in more than 20 different process nodes thanks to:
-
Our “Virtual Fab” Process: Design and simulation performed
-
with a set of calibrated models guaranteeing a higher robustness.
-
A set of innovations and patented solutions.
-
A track record of Right-on-First pass silicon in different process nodes and foundries.
-
An audio quality perceived by Golden Ears to be as good as the best external codec IC’s.
Improve your RoI thanks to the best performance / silicon area trade-off!
Avoid over-sizing the audio converters to get reasonable sound quality after integration, as SNR and THD are guaranteed on silicon:
Ensure the best SoC value with a customized ADC/DAC/CODEC thanks to JAXAUDIO
Various Virtual Components configurations are possible thanks to JAXAUDIO, a kit of pre-defined elements for building high resolution solutions for voice or audio applications. As a result, an audio component consists of the best combination and assembly of peripherals around ADC and DAC cores, corresponding to customer specific application.
Improve your RoI thanks to the lowest Bill-of-Material
The lowest silicon area is achieved at no compromise on PCB contents:
-
Speaker and headphone drivers are proposed with discrete-free connections
-
Single-ended application schematics of analog inputs and outputs can be provided to reduce the number of pins
-
Direct battery connection is enabled thanks to embedded power-supply voltage regulators
Ensure your Time-to Fab
-
The kit approach avoids designing from scratch.
-
Ensure a smooth integration flow thank to a complete set of deliverables:
- Digital Model for SoC simulation
- Reference layout for routing to Pads
- Sockets for LVS and DRC
- Integration rules
- Application schematics and PCB guidelines
-
Check compliance with Integration Rules before tape-out through GDSII review.
-
Ensure a proper usage of the deliverables through a set of acceptance testbenches and their associated reviews with the design team.
-
Address in real time all other specific questions related to integration through our ViC Engineering Support.
|
Printer-friendly version
